HGLASER

PCB Microelectronics Division
Measuring company

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公司介绍
Solutions
Innovation linkage for a better world
IGBT
With product requirements as the orientation, our company focuses on the field of semiconductor packaging ceramic carrier boards and applies our profound technical expertise and outstanding innovation capabilities to make industry-leading efficient automated laser processing equipment, vision inspection equipment, providing systematic, intelligent industry solutions for ceramic carrier board clients so as to support the high-quality development of the semiconductor industry chain.
  • PCBA Laser cutting of ceramic substrates

    Ceramic substrate laser cutting machine can be applied in IGBT, MOSFET power semiconductor packaging ceramic carrier board industry. It is suitable for laser cutting, scribing processing of materials like alumina, aluminum nitride, silicon nitride, etc.

  • PCB Laser marking on ceramic substrates

    Ceramic substrate laser marking machine is applied in IGBT, MOSFET power semiconductor packaging ceramic substrate industry and it is suitable for laser marking characters, QR codes, etc., on various ceramic and metal materials for traceability.


  • PCBA Ceramic laser drilling

    Ceramic laser perforating machine is applied in LED, LD, VCSEL, and other chip packaging ceramic substrate industries and it is used for high-speed, high-density, high precision laser drilling processing of ceramics, like alumina, aluminum nitride, silicon nitride, etc.

  • PCB AOI detection of ceramic substrates

    Ceramic substrate AOI inspection equipment is applied in IGBT, MOSFET power semiconductor packaging ceramic substrate industry and it can inspect various structural and appearance defects on ceramic substrates.


National sales hotline
400-0000-000